nichia sts-da1-1567b nichia corporation specifications for white led nesw064at pb-free reflow soldering application built-in esd protection device rohs compliant
nichia sts-da1-1567b 1 specifications (1) absolute maximum ratings item symbol absolute maximum rating unit forward current i f 30 ma pulse forward current i fp 100 ma allowable reverse current i r 85 ma power dissipation p d 105 mw operating temperature t opr -40~110 c storage temperature t stg -40~110 c junction temperature t j 125 c * absolute maximum ratings at t a =25c. * i fp conditions with pulse width 10ms and duty cycle 10%. (2) initial electrical/optical characteristics item symbol condition typ unit forward voltage v f i f =20ma 3.1 v i f =20ma 1.5 luminous intensity i v i f =30ma 2.0 cd x - i f =20ma 0.31 - chromaticity coordinate y - i f =20ma 0.32 - thermal resistance r js - 180 c/w thermal resistance r ja - 360 c/w * characteristics at t a =25c. * chromaticity coordinates as per cie 1931 chromaticity chart. * r js is thermal resistance from junction to t s measuring point. * r ja is thermal resistance from junction to ambient test board: fr4 board thickness=1.6mm, copper layer thickness=35m .
nichia sts-da1-1567b 2 ranks item rank min max unit forward voltage - 2.8 3.5 v v 1.44 2.00 u 1.00 1.44 luminous intensity t 0.72 1.00 cd color ranks rank a0 rank b1 x 0.280 0.264 0.283 0.296 x 0.287 0.283 0.330 0.330 y 0.248 0.267 0.305 0.276 y 0.295 0.305 0.360 0.339 rank b2 rank c0 x 0.296 0.287 0.330 0.330 x 0.330 0.330 0.361 0.356 y 0.276 0.295 0.339 0.318 y 0.318 0.360 0.385 0.351 * ranking at t a =25c. * forward voltage tolerance: 0.05v * luminous intensity tolerance: 7% * chromaticity coordinate tolerance: 0.005 * leds from the above ranks will be shipped. the rank combination ratio per sh ipment will be decided by nichia.
nichia sts-da1-1567b 3 chromaticity diagram a0 b1 b2 c0 0.20 0.25 0.30 0.35 0.40 0.45 0.20 0.25 0.30 0.35 0.40 0.45 x y
nichia sts-da1-1567b 4 outline dimensions sts-da7-0427 nxsw064x ? no. ( g unit: mm) this product complies with rohs directive. u? rohs ?m??? * ( g unit: mm, tolerance: 0.2) ka o protection device (0.45) 0.80.3 ? item ??`| package materials ??| encapsulating resin materials ?O| electrodes materials | weight description ????` heat-resistant polymer ?`? ? + w? silicone resin (with diffuser and phosphor) ~? + y? ag-plated copper alloy 0.036g(typ) anode cathode (2.4) 2.8 (2.4) 3.2 cathode mark 20.3 2.2 (1.05) (0.8) 3.50.3 (1.9) 0.80.3 (0.4)
nichia sts-da1-1567b 5 soldering ? recommended reflow soldering condition(lead-free solder) ? recommended hand soldering condition temperature 350c max soldering time 3sec max ? recommended soldering pad pattern ( g unit: mm) 4 4 9.5 2.6 1.5 4 1.5 blank boxes: solder resist opening , shaded areas: footprint * this led is designed to be reflow soldered on to a pc b. if dip soldered, nichia cannot guarantee its reliability. * reflow soldering must not be perform ed more than twice. hand soldering mu st not be performed more than once. * avoid rapid cooling. ramp down the temp erature gradually from the peak temperature. * nitrogen reflow soldering is recommended. air flow soldering conditions can cause optical degradation, caused by heat and/or atmosphere. * since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin. pressure can cause nicks, chip-outs, encapsulant delaminati on and deformation, and wire br eaks, decreasing reliability. * repairing should not be done after the leds ha ve been soldered. when repairing is unavoidable, a double-head soldering iron should be used. it should be confirmed beforehand whether the characteristics of the leds wi ll or will not be damaged by repairing. * when soldering, do not apply stre ss to the led while the led is hot. * when using a pick and place machine, choose an appropriat e nozzle for this product. using a pick-and-place nozzle with a smaller diameter than the size of the led's em itting surface will cause damage to the emitting surface and may also cause the led not to illuminate. * the recommended soldering pad pattern is design ed for attachment of the led without problems. when precise mounting accuracy is required, such as high-density mounting, ensure that the size and shape of the pad are suitable for the circuit design. * consider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder. * when flux is used, it should be a ha logen free flux. ensure that the manufacturing process is not designed in a manner where the flux will come in contact with the leds. * make sure that there are no issues with the type and amount of solder that is being used. 120sec max pre-heat 180 to 200c 260cmax 10sec max 60sec max above 220c 1 to 5c per sec
nichia sts-da1-1567b 6 tape and reel dimensions cathode mark -0 1 +0.25 2.85 0.1 sts-da7-0165a reel size: 2000pcs 1 `?? 2000 ? * nxxx064x 0.25 0.05 2.15 0.1 3.65 0.1 ?` / ` trailer and leader top cover tape led ?? ` 400mm ?` 160mm ? trailer 160mm min(empty pockets) loaded pockets ???` embossed carrier tape ???`?` feed direction leader without top cover tape 400mm min 100mm ? leader with top cover tape 100mm min(empty pocket) the tape packing method complies with jis c 0806 (packaging of electronic components on continuous tapes). * jis c 0806 ???`??????? ? no. ( g unit: mm) 60 +1 -0 `? reel f 1 3 0 . 2 f 2 1 0 . 8 ? label 2 1 0 . 8 1 3 0 . 2 11.4 1 9 0.3 180 +0 -3 -0 1.5 +0.1 ?`??? tape 4 0.1 1.75 0.1 4 0.1 2 0.05 3.5 0.05 8 +0.3 -0.1 when the tape is rewound due to work interruptions, no more than 10n should be applied to the embossed carrier tape. the leds may stick to the top cover tape. * g?I???????`?`??? ???`??? (10n ) ? led `?`?N???
nichia sts-da1-1567b 7 packaging - tape & reel nichia led sts-da7-0006c nxxxxxxx ? label ? label ? no. reel ` ?` seal moisture-proof bag ?? rohs nxxxxxxx xxxx led ******* nichia corporation 491 oka, kaminaka, anan, tokushima, japan type lot qty. ymxxxx-rrr pcs rohs nxxxxxxx xxxx led ******* rrr pcs type rank qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan reels are shipped with desiccants in heat-sealed moisture-proof bags. ????`??????`???? desiccants ? moisture-proof bags are packed in cardboard boxes with corrugated partitions. ??K???`? ?`???????y?????? * ??\H?y?B???y? * ?QH??n?????u?p?????? * using the original package material or equivalent in transit is recommended. do not expose to water. the box is not water-resistant. do not drop or expose the box to external forces as it may damage the products. products shipped on tape and reel are packed in a moisture-proof bag. they are shipped in cardboard boxes to protect th em from external forces during transportation. * u???`?????n?go??`y? if not provided, it will not be indicated on the label. ******* is the customer part number. O??????? * ******* ?? ? for details, see "lot numbering code" in this document. * ??????????? the label does not have the rank field for un-ranked products. * ???????????
nichia sts-da1-1567b 8 lot numbering code lot number is presented by using the following alphanumeric code. ymxxxx - rrr y - year year y 2009 9 2010 a 2011 b 2012 c 2013 d 2014 e m - month month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx-nichia's product number rrr-ranking by color coordinates, ranking by luminous intensity
nichia sts-da1-1567b 9 derating characteristics nesx064x sts-da7-0856 ? no. derating1 0 10 20 30 40 50 0 20406080100120 (76, 30.0) (11 0, 10 .0) derating2 0 10 20 30 40 50 0 20406080100120 (10 5, 30 .0 ) ( 110, 25.0) duty 10 100 1000 1 10 100 30 S allowable forward current ( ma ) `??????-S solder temperature(c athode side) vs allowable forward current ??-S ambient temperature vs allowable forward current S allowable forward current(ma) S allowable forward current(ma) `?????? solder temperature(cathode side)(c) ?? ambient temperature(c) ?`?` duty ratio(%) ?`?`-S duty ratio vs allowable forward current t a =25c
nichia sts-da1-1567b 10 optical characteristics nesw064a ? no. sts-da7-0857 spectrum 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 700 750 relative l umin osity( a.u .) directivity1 90 80 70 60 50 40 30 20 10 0 -10 -20 -30 -40 -50 -60 -70 -8 0 -90 k??? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 10.500.51 20ma i f = t a =25c * ??? all characteristics shown are for reference only and are not guaranteed. 20ma i fp = t a =25c
nichia sts-da1-1567b 11 forward current characteristics / temperature characteristics nesw064a sts-da7-0858 ? no. tavf 2.0 2.5 3.0 3.5 4.0 4.5 -60 -40 -20 0 20 40 60 80 100 120 ta iv 0.6 0.8 1.0 1.2 1.4 -60 -40 -20 0 20 40 60 80 100 120 vfif 1 10 100 2.0 2.5 3.0 3.5 4.0 4.5 20 relative luminous flux(a.u.) ??- ambient temperature vs relative luminous flux forward current(ma) ifiv 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 20406080100120 relative luminous flux(a.u.) - forward current vs relative luminous flux forward current(ma) ?R- forward voltage vs forward current ??-?R ambient temperature vs forward voltage ?R forward volta g e ( v ) ?R forward voltage(v) ?? ambient temperature( c) ?? ambi ent t em p erature ( c ) t a =25c * ??? all characteristics shown are for reference only and are not guaranteed. t a =25c i fp = 20 ma i fp = 20 ma i fp = 60 ma i fp = 5 ma
nichia sts-da1-1567b 12 forward current characteristics / temperature characteristics ? no. nesw064a sts-da7-0859 taxy 0.30 0.31 0.32 0.33 0.34 0.35 0.29 0.30 0.31 0.32 0.33 0.34 -40 c 0c 25 c 50c 110c x ifxy 0.30 0.31 0.32 0.33 0.34 0.35 0.29 0.30 0.31 0.32 0.33 0.34 1ma 5ma 20ma 30ma 100ma x y y 20 ma i fp = ??-? ambient temperature vs chromaticity coordinate -? forward current vs chromaticity coordinate t a =25c * ??? all characteristics shown are for reference only and are not guaranteed.
nichia sts-da1-1567b 13 reliability (1) tests and results te s t reference standard test conditions te s t duration failure criteria # units failed/tested resistance to soldering heat (reflow soldering) jeita ed-4701 300 301 t sld =260c, 10sec, 2reflows, precondition: 30c, 70%rh, 168hr #1 0/22 solderability (reflow soldering) jeita ed-4701 303 303a t sld =2455c, 5sec, lead-free solder(sn-3.0ag-0.5cu) #3 0/22 thermal shock jeita ed-4701 300 307 -40c to 110c, 1min dwell, 10sec transfer, precondition: 30c, 70%rh, 168hr 100cycles #1 0/100 temperature cycle jeita ed-4701 100 105 -40c(30min)~25c(5min)~ 110c(30min)~25c(5min) 100cycles #1 0/100 moisture resistance (cyclic) jeita ed-4701 200 203 25c~65c~-10c, 90%rh, 24hr per cycle 10cycles #1 0/100 high temperature storage jeita ed-4701 200 201 t a =110c 1000hours #1 0/100 temperature humidity storage jeita ed-4701 100 103 t a =60c, rh=90% 1000hours #1 0/100 low temperature storage jeita ed-4701 200 202 t a =-40c 1000hours #1 0/100 room temperature operating life t a =25c, i f =30ma 1000hours #2 0/100 high temperature operating life t a =85c, i f =25ma 1000hours #2 0/100 temperature humidity operating life 60c, rh=90%, i f =20ma 1000hours #2 0/100 low temperature operating life t a =-40c, i f =20ma 1000hours #2 0/100 permanence of marking jeita ed-4701 500 501 isopropyl alcohol, 235c, dipping time: 5min 1time #1 0/22 vibration jeita ed-4701 400 403 200m/s 2 , 100~2000~100hz, 4cycles, 4min, each x, y, z 48minutes #1 0/10 free fall 3drops from a height of 75cm #1 0/10 electrostatic discharges jeita ed-4701 300 304 hbm, 2kv, 1.5k ? , 100pf, 3pulses, alternately positive or negative #1 0/22 notes: measurements are performed after allowi ng the leds to return to room temperature. (2) failure criteria criteria # items conditions failure criteria forward voltage(v f ) i f =20ma >u.s.l.1.1 #1 luminous intensity(i v ) i f =20ma u.s.l.1.1 #2 luminous intensity(i v ) i f =20ma nichia sts-da1-1567b 14 cautions (1) storage conditions temperature humidity time before opening aluminum bag 30c 90%rh within 1 year from delivery date storage after opening aluminum bag 30c 70%rh 168hours baking 655c - 24hours product complies with jedec msl 3 or equivalent. see ipc/jedec std-020 for moisture-sensitivity details. absorbed moisture in led packages can vaporize and expand during soldering, which can cause interface delamination and result in optical performan ce degradation. products are packed in moisture-proof aluminum bags to minimize moisture absorption during transportation and storage. included silica gel desiccants change from blue to red if moisture had penetrated bags. after opening the moisture-proof aluminum bag, the products should go through the soldering process within the range of the conditions stated above. unused remaining leds should be stored with silica gel desiccants in a hermetically sealed container, preferab ly the original moisture-proof bags for storage. after the ?period after opening? storage time has been exceeded or silica gel desiccants are no longer blue, the products should be baked. baking should only be done once. customer is advised to keep the leds in an airtight cont ainer when not in use. exposure to a corrosive environment may cause the plated metal parts of the product to tarnish, which could adversely affect soldering and optical characteristi cs. it is also recommended to return the leds to the original moisture proof bags and reseal. after assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials in close proximity of the leds within an end product, and the gases entering into the product from the external atmosphere. the above should be taken into consideration when designing. resin materials, in particular, may contain substanc es which can affect silver plating, such as halogen. do not use sulfur-containing materials in commercial products. some materials, such as seals and adhesives, may contain sulfur . the extremely corroded or contaminated plating of leds mi ght cause an open circuit. silicone rubber is recommended as a material for seals. bear in mind, the use of silico nes may lead to silicone contamination of electrical contacts inside the products, caused by low molecular weight volatile siloxane. to prevent water condensation, please avoid large temperat ure and humidity fluctuations for the storage conditions. do not store the leds in a dusty environment. do not expose the leds to direct sunlight and/or an environment where the temperature is higher than normal room temperature. (2) directions for use when designing a circuit, the curre nt through each led must not exceed the absolute maximum rating. operating at a constant current per led is recommended. in case of operating at a constant voltage, circuit b is recommended . if the leds are operated with constant voltage using circui t a, the current through the leds may vary due to the variation in forward voltage ch aracteristics of the leds. (a) ... (b) ... this product should be operated using forward curre nt. ensure that the product is not subjected to either forward or reverse voltage while it is not in use. in particular, subjecting it to continuous reverse voltage may cause migration, which may cause damage to the led die. when used in displays that are not used for a long time, the main power supply should be switched off for safety. it is recommended to operate the leds at a current greater th an 10% of the sorting current to stabilize the led characteristic s. ensure that excessive voltages such as li ghtning surges are not applied to the leds. for outdoor use, necessary measures should be take n to prevent water, moisture and salt air damage.
nichia sts-da1-1567b 15 (3) handling precautions do not handle the leds with bare hands as it will contaminat e the led surface and may affect the optical characteristics: it might cause the led to be deformed and/or the wi re to break, which will cause the led not to illuminate. the lead could also cause an injury. when handling the product with tweezers, be ca reful not to apply excess ive force to the resin. otherwise, the resin can be cut, ch ipped, delaminate or deform ed, causing wire-bond breaks and catastrophic failures. dropping the product may cause damage. do not stack assembled pcbs together. failure to comply can cause the resin portion of the product to be cut, chipped, delaminated and/or deformed. it may cause wi re to break, leading to catastrophic failures. (4) design consideration pcb warpage after mounting the products onto a pcb can cause the package to break. the led should be placed in a way to minimize the stress on the leds due to pcb bow and twist. the position and orientation of the leds affect how much mechanical stress is exerte d on the leds placed near the score lines. the led should be placed in a way to minimize the stress on the leds due to board flexing. board separation must be performed using special jigs, not using hands. (5) electrostatic discharge (esd) the products are sensitive to static electricity or surge voltage. esd can damage a die and its reliability. when handling the products, the following measures against electrostatic discharge are strongly recommended: eliminating the charge grounded wrist strap, esd footwear, clothes, and floors grounded workstation equipment and tools esd table/shelf mat made of conductive materials ensure that tools (e.g. soldering irons), jigs and mach ines that are being used are properly grounded and that proper grounding techniques are used in wo rk areas. for devices/equipment that mount the leds, protection against surge voltages should also be used. if tools or equipment contain insulating materials such as glass or plastic, the following measures against electros tatic discharge are strongly recommended: dissipating static charge with conductive materials preventing charge generation with moisture neutralizing the charge with ionizers the customer is advised to chec k if the leds are damaged by esd when performing the characteristics insp ection of the leds in the application. damage can be detected with a forward voltag e measurement or a light-up test at low current ( 1ma). esd damaged leds may have current flow at a low voltage or no longer illuminate at a low current. failure criteria: v f <2.0v at i f =0.5ma (6) thermal management proper thermal management is an impo rtant when designing products with le ds. led die temperature is affected by pcb thermal resistance and led spacing on the board. please design products in a way that the led die temperature does not exceed the maximum junction temperature (t j ). drive current should be determined for the surrounding ambient temperature (t a ) to dissipate the heat from the product. (7) cleaning the leds should not be cleaned with water, benzine, and/or thinner. if required, isopropyl alcohol (ipa) should be used. ot her solvents may cause premature failure to the leds due to the damage to the resin portion. the effects of such solvents should be verified prior to use. in addition, the use of cfcs such as freon is heavily regulated. when dust and/or dirt adheres to the leds, soak a cloth with is opropyl alcohol (ipa), then sque eze it before wiping the leds. ultrasonic cleaning is not recommended sinc e it may have adverse effects on the leds depending on the ultrasonic power and how led is assembled. if ultrasonic cleaning must be used, the customer is advise d to make sure the leds will not be damaged prior to cleaning.
nichia sts-da1-1567b 16 (8) eye safety in 2006, the international electrical commission (iec) published iec 62471:2006 photobiological safety of lamps and lamp systems, which added leds in its scope. on the other hand, the iec 60825-1:2007 laser safety standard removed leds from its scope. however, please be advised that some countries and regions have adopted standards based on the iec laser safety standard iec 60825- 1:20112001, which still includes leds in its scope. most of nichia's leds can be classified as belo nging into either the exempt group or risk group 1. high-power leds, that emit ligh t containing blue wavelengths, may be classified as risk group 2. please proceed with caution when viewing directly any leds driven at high current, or viewing leds with optical instruments which may greatly increase the damages to your eyes. viewing a flashing light may cause eye discomfort. when incorporating the led into your product, please be careful to avoid adverse effects on the human body caused by light stimulation. (9) others the leds described in this brochure are intended to be used for ordinary electronic equipmen t (such as office equipment, communications equipment, measurement instruments and household appliances). consult nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as for airplanes, aerospace, submersibl e repeaters, nuclear reactor co ntrol system, automobiles, traffic control equipment, life support systems and safety devices). the customer shall not reverse engineer by disassembling or analysis of the leds without having prior written consent from nichia. when defective leds are found, the customer sh all inform nichia directly before disassembling or analysis. the specifications and appearance of th is product may change without notice; nichia does not guarantee the contents of this specification. both the customer and nichia will agree on the official specifications of supplied products before the volume production of a program begins.
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